
ngineered for free Xilinx W
PA
K embedded
rocesso
USB controller by
U
B 2.0 b
Key Features
ndustrial-
rade Xilinx S
artan-6 LX
P
A micro-module
45/75/100/150
ini-USB 2.0 hi
h-speed device (for confi
uration and
eration
6-bit-wide 1 Gb
128 MB
DR3
DRAM
4 Mbit (8 Mb
te)
PI Flash memory (for confi
uration and
peration) accessible throu
h:
P
A
TAG
ort
SPI indirect
B
PGA confi
uration throu
h:
2B
nn
t
r
TAG
ort
PI Flash memor
lu
-on module with 2 × 80-pin stackin
connectors
p to 40 differential and up to 109 sin
le-ended FPGA I/O
ins available on B2B connectors
.2 V, 1.5 V, 2.5 V = VCCAUX and 3.3 V
ower rails
4 MHz and 100 MHz reference clock si
nals
FUSE bit-stream encryption (LX75 or lar
er)
r LED
user
ush-button
r DIP
wit
h
venly-spread supply pins for
ood si
nal inte
rity
Development Suite
A hardware develo
ment
latform is available. Latest
documentation, desi
n support
les and software develo
ment
suite are available for download free of char
e
User manual, a
lication note
Schematics, assembly dia
ram
B 2.0 and DDR
DRAM data communication API
Device drivers
mw
IP-cores
DMA, EZ-USB, I2C
Pro
rammin
tools (SPI Flash
R
f
r
n
it-
tr
m
Reference desi
n
Reference Xilinx MicroBlaze s
stem (EDK
Assembly Options
mo
u
e c
as
og
c ce
MA
0600
45
E
LX7
1
0600
100 1
11
0600
150
1
ustom assembly options for cost or performance optimization
are ava
a
e upon request
www.trenz-electronic.de
te063
5
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